1. Linear incandescent lamp（線型白熾燈）；
2. Mercury in switches（開關中的汞）；
3. Special ICs having tin-lead solder plating on leads used in professional equipment（專業設備中所含鍍有鉛錫焊料的鉛的特殊集成電路）；
4. Specific modular units including tin-lead solder being used in special professional equipment（特殊專業設備中包含鉛錫焊料的特定組合單元）；
5. Solders containing lead and /or cadmium for specific applications where local temperature is higher than 150 deg C and which need to work properly more than 500 hours（局部溫度超過150℃且需要正常工作500小時以上的特定用途的含有鉛和/或鎘的焊料）；
6. Lead in solder for printed circuit boards for emergency lighting products（應急照明產品中印刷電路板所用焊料中的鉛）；
7. Hexavalent chromium (Cr-VI) in chromate conversion coatings as surface treatment（表面處理用鉻酸鹽轉化涂層中的六價鉻）；
8. Lead in gas sensors（煙霧探測器中的鉛）；
9. Concerning of PbO (Lead in Seal Frit) used for making BLU (Back Light Unit) Lamp（與用于制造背景燈的PbO（密封釉料中的鉛）相關的）；
10. Cadmium in opto-electronic components（光電元件中的鎘）；
11. Non-consumer mechanical power transmission systems including speed reducers and mechanical couplings which rely on electrical/electronic components for safe control and operation（依靠電子/電器元件來進行**控制和操作的減速器和機械連接器等非消費型機械式能量傳遞系統）；
12. Electrical and electronic components contained in heating ventilating and air conditioning building systems, commercial refrigeration systems and transport refrigeration systems（加熱通風和空調建筑系統、商用冷卻系統和運輸冷卻系統中的電子和電器元件）；
13. Cadmium-bearing copper alloys（含鎘的銅合金）；
14. Electrical/electronic components contained mobile and stationary air compressors and vacuum systems, compressed air contaminant removal systems and pneumatic contractor’s air tools（含有電子/電器元件的移動和固定空氣壓縮機和真空系統、壓縮氣體污染物**系統和氣動壓縮機的氣體工具）；
15. Electrical/electronic equipment that are: used in transport -aviation, aerospace, road, maritime, rail; installed in to the fabric of buildings ? elevators, escalators, moving walks, dumb waiters, and heating, cooling and ventilation systems, and fire and security systems; used in the energy generation and transmission; used in mining and mineral processing; used for non-consumer mechanical power transmission systems; industrial process pumps and compressors; used in industrial refrigeration; and used in military applications（以下電子/電氣設備：航運、航天、道路、海運、鐵路中使用的；建筑物構造??電梯、電動扶梯、移動走道、小型運貨升降機、加熱、冷卻和通風系統、防火**系統中安裝的；能量產生和傳輸中使用的；采礦和礦石加工中使用的；非消費型機械式能量傳遞系統中使用的；工業作用泵和壓縮機；工業制冷用的；**設備中使用的）；
16. Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers（大功率專業用和商用擴音器中的傳感器中作為電氣/機械焊料的鉛合金）；
17. Cadmium oxide（氧化鎘）；
18. Solder tin of the thermo fuse with a defined low melting point（有固定低熔點的溫度保險絲中的錫焊料）；
19. Lead in lead oxide glass used in plasma display panel (PDP)（氧化鉛玻璃等離子顯示器面板中使用的鉛）；
20. Lead in solder on small PCB and tinned legs of primary components（小型印刷電路板和初級元件的鍍錫引線所用焊料中的鉛）；
21. Use of the not lead free component NEC V25 in the Memor 2000（2000年備忘錄中非無鉛元件NEC V25的使用）；
22. Lead used in shielding of radiation for Non Medical X-ray equipment（非醫用X光機的射線防護屏中使用的鉛）；
23. Lead based solders sealed or captured within heat-shrinkable components and devices（熱收縮性元件和設備中密封或俘獲的鉛基焊料）.
